View Issue Details
| ID | Project | Category | View Status | Date Submitted | Last Update |
|---|---|---|---|---|---|
| 0000854 | K18X001.00 SKB SWAN | HW | public | 2020-07-18 00:59 | 2021-12-24 20:15 |
| Reporter | (HW) Sean Chiang | Assigned To | (ALTech) SH Son | Due Date | |
| Priority | normal | Severity | s2-severe | Reproducibility | N/A |
| Status | closed | Resolution | fixed | ||
| Summary | 0000854: [SWAN] Thermal simulation result | ||||
| Description | [SWAN] Thermal simulation result | ||||
| Tags | 3823 | ||||
| Attach Tags | |||||
| parent of | 0000852 | closed | (HW) Tom Lee | [SWAN] Simulation report |
| related to | 0000885 | closed | (HW) Sean Chiang | [SWAN] EVT HW Data |
| User List |
(ALTech) Philip , (ALTech) SH Son , (ALTech) SY Yoon , |
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Hi SH, Update the thermal simulation result based on different power consumption of audio amplifier. |
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Hi Sean. Thanks for reviewing about thermal simulation as current mechanical design. ALT will review and check power consumption relate audio user scenario and give feedback to you. And Foxconn side please review the thermal solutions beside AMP block power consumption. I know AMP current is critical parameter on this issue, but we have to fine the other way to reduce thermal. Action item. Please review in the following order. 1. Add more vent hole : The current structure is a poor airflow design. So, add vent holes to improve airflow. Below A and B area can be modify vent hole without affect design the mechanical structure. So, Please tell me how to improve the structure of the vent hole by your thermal engineers’ idea A. Front side wall area B. PCBA bottom surface 2. Other heatsink or other Thermal solution Change the heatsink structure or consider alternative thermal solutions. 3. Other suggestions for resolving issues If you have any question, please let us know Thnaks SON |
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Hi SH, Thanks for your comment. The major problem for the thermal issue now is that the total power of speakers is too high. Currently, we will try to enlarge the PCBA size to spread the heat from ICs itself first, and then will add some thermal solutions like increase the venting hole, add more/larger heat spreaders or add some graphite sheet at inner of housing to spread the hot sopt etc. Our thermal team is working on that and will give you an update later today. |
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(HW) Sean Chiang 2020-07-22 09:30 developer 0000852:0003817 Hi Mr.Yoon and Philip, Upload the thermal simulation report of separated PCBA (Main board & AMP/IO board) as attached. Result_K18X001.00 power consumption table_VS550_20200721.xls (1,299,968 bytes) |
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HI Sean and thermal Team. ALT and Inlek update 3d modeling data for thermal. There are add vent hole at bottom side and gap between bottom and surface. it can be more helpful to reduce the thermal. Please do simulation again using this modeling data. Thanks SON |
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Hi Philip and Mr.Yoon, Please find attached for the one board thermal simulation result based on 25deg. & 50deg. ambient temperature. The power consumption of AMP are based on 60W * 70%(rms) = 42W (21W: mid range & tweeter, 21W: woofer) All of the ICs can passed its specification but the housing temperature are failed. For the simulation result of all ICs, please refer to "Thermal data" table. and for the housing surface temperature, please refer to "Thermal result" sheet. |
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Hi Philip and Mr.Yoon, Update the thermal simulation report that combines the result of one board & two board with solutions. Let's review it soon today. |
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Hi Daniel, Reply 0000854:0003823 Please update 3D modeling data with venting hole and provide to thermal team for simulation. |
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Hi Mr.Yoon and Philip, Update thermal simulation result as attached file although the PCB size of SoC board is not finalize yet. We add option 1 (shrink the size of bottom heat spreader + AL foil) & option 2 (only add Bottom venting + 5mm height foot ) as comparison. Please review it and let us know if there is any further questions. Thanks. |
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Hi SH and Philip, About the thermal solution of separated SoC board, as we still worried about the performance of high speed signal and complicate signals between SoC board and AMP/IO board. Therefore, we also have considered the separated AMP board solution and do the simulation in parallel actually, and so far it looks that the result still can pass the delta 20deg. @ Top & delta 30deg. @ bot. So, I would like to give you a heads up and please check the initial simulation result as attached. Our thermal team is still working on the solution fine tune, and will update the result tomorrow morning. ME Daniel also will check the structural design of this solution, and provide our ME proposal later tomorrow. |
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Sean reply 0000854:0003877 Thank you for your update. but, the Foxconn has the role of thermal solution. So Please review and propose the final thermal solution for SWAN. then we will support to you. as we know, the project schedule is delayed due to thermal. We hope It can finish by this week. Thanks SON |
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Hi SH, We understand that and thanks for your fully support. Please find attached for the latest thermal result of SWAN. We added 25deg,C ambient temp. condition in the report. ME Daniel will provide the mechanical design proposal later today. Please send that to INKEL review and confirm asap. Thanks, Sean |
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The SWAN already entered the MP stage. There is no further action needed for this issue. So, we close this mantis issue. Thanks! |
| Date Modified | Username | Field | Change |
|---|---|---|---|
| 2020-07-18 00:59 | (HW) Sean Chiang | New Issue | |
| 2020-07-18 00:59 | (HW) Sean Chiang | Status | new => assigned |
| 2020-07-18 00:59 | (HW) Sean Chiang | Assigned To | => (ALTech) SH Son |
| 2020-07-18 00:59 | (HW) Sean Chiang | File Added: Fruitland-R DVT Thermal Test_20190524.xlsx | |
| 2020-07-18 01:02 | (HW) Sean Chiang | Issue Monitored: (HW) Sean Chiang | |
| 2020-07-18 01:04 | (HW) Sean Chiang | Issue Monitored: (HW) Catherine Chen | |
| 2020-07-18 01:04 | (HW) Sean Chiang | Issue Monitored: (HW) Tom Lee | |
| 2020-07-18 01:04 | (HW) Sean Chiang | Issue Monitored: (ALTech) SH Son | |
| 2020-07-18 01:05 | (HW) Sean Chiang | Issue Monitored: (ALTech) Philip | |
| 2020-07-18 01:08 | (HW) Sean Chiang | File Added: Result_K18X001.00 power consumption table_VS550_20200717.pdf | |
| 2020-07-18 01:08 | (HW) Sean Chiang | Note Added: 0003794 | |
| 2020-07-20 11:04 | (ALTech) SH Son | Relationship added | parent of 0000852 |
| 2020-07-20 11:57 | (ALTech) SH Son | File Added: RE_ _SKB Eagle (T99X171) 0000854__ _SWAN_ Thermal simulation result.msg | |
| 2020-07-20 11:57 | (ALTech) SH Son | Note Added: 0003798 | |
| 2020-07-20 13:48 | (HW) Sean Chiang | Issue Monitored: (RD) Fu-chiang Young | |
| 2020-07-20 13:49 | (HW) Sean Chiang | Issue Monitored: (PM) Henry Chiou | |
| 2020-07-20 13:50 | (HW) Sean Chiang | Note Added: 0003799 | |
| 2020-07-22 13:22 | (ALTech) SH Son | Note Added: 0003822 | |
| 2020-07-22 13:25 | (ALTech) SH Son | File Added: 2007221405_3d_forThermal_2nd.zip | |
| 2020-07-22 13:25 | (ALTech) SH Son | File Added: (2020.0722) Thermal 시뮬레이션용_2nd_PCBA_STB영역 모델링_INKEL.PDF | |
| 2020-07-22 13:25 | (ALTech) SH Son | Note Added: 0003823 | |
| 2020-07-22 13:27 | (ALTech) SH Son | Note Edited: 0003823 | |
| 2020-07-22 23:16 | (HW) Sean Chiang | File Added: Result_K18X001.00 power consumption table_VS550_20200722a.xls | |
| 2020-07-22 23:16 | (HW) Sean Chiang | Note Added: 0003833 | |
| 2020-07-23 14:09 | (HW) Sean Chiang | File Added: Result_K18X001.00 power consumption table_VS550_20200723A.xls | |
| 2020-07-23 14:09 | (HW) Sean Chiang | Note Added: 0003842 | |
| 2020-07-24 15:25 | (HW) Sean Chiang | Issue Monitored: (ME) Daniel Hu | |
| 2020-07-24 17:24 | (HW) Sean Chiang | Note Added: 0003856 | |
| 2020-07-24 17:27 | (ME) Daniel Hu | Tag Attached: 3823 | |
| 2020-07-27 15:06 | (HW) Sean Chiang | Issue Monitored: (ALTech) SY Yoon | |
| 2020-07-27 15:06 | (HW) Sean Chiang | File Added: Result_K18X001.00 power consumption table_VS550_20200727v1.xls | |
| 2020-07-27 15:06 | (HW) Sean Chiang | Note Added: 0003870 | |
| 2020-07-28 16:44 | (HW) Sean Chiang | File Added: Result_K18X001.00 power consumption table_VS550_20200728.xls | |
| 2020-07-28 16:44 | (HW) Sean Chiang | Note Added: 0003877 | |
| 2020-07-28 20:43 | (ALTech) SH Son | Note Added: 0003881 | |
| 2020-07-29 19:46 | (HW) Sean Chiang | File Added: Result_K18X001.00 power consumption table_VS550_20200729.xls | |
| 2020-07-29 19:46 | (HW) Sean Chiang | Note Added: 0003889 | |
| 2020-08-20 14:04 | (ALTech) SH Son | Relationship added | related to 0000885 |
| 2020-11-13 11:21 | (SW) Jacky Chiang | Project | T99X171.00 SKB Eagle => K18X001.00 SKB SWAN |
| 2021-12-23 19:07 | (HW) Sean Chiang | Status | assigned => resolved |
| 2021-12-23 19:07 | (HW) Sean Chiang | Resolution | open => fixed |
| 2021-12-24 20:15 | (HW) Sean Chiang | Note Added: 0009139 | |
| 2021-12-24 20:15 | (HW) Sean Chiang | Status | resolved => closed |
